On the morning of April 3, Zhang Shiming, the chairman of China Overseas Holdings Group, was invited to Chengdu to attend the signing ceremony of the major projects in Sichuan Bengbu City. At the signing site, the Group signed a contract with the Chengdu Municipal People's Government for investment in semiconductor microdisplay and smart terminal production base projects. Li Honghui, vice president of the group, and Xiao Yuxin, general manager of the operation management department, and leaders of relevant departments and departments of Chengdu, Ganzi Prefecture and Handan City attended the signing ceremony.

The project is located in the compound semiconductor eco-industrial park, covering an area of about 700 mu with a total investment of 10 billion yuan. It will be constructed in two phases. The first phase of the project will invest 6 billion yuan and cover an area of 400 mu. It will build a high-brightness LED/Micro LED micro-display base and a large-scale application base for microwave power devices. The second phase of the project will invest 4 billion yuan. Wearable equipment, intelligent mobile terminals and special equipment production bases.

At present, the Group has completed the comprehensive design work of the project. It is expected to start construction in October 2019 and be completed and put into operation in early 2021. After the project is completed and put into production, the annual sales revenue is expected to be no less than 30 billion yuan. The investment will further improve the advanced semiconductor industry chain in Handan City and consolidate the Chengdu semiconductor industry ecosystem, attracting more upstream and downstream enterprises to Chengdu, and contributing to the economic construction of Chengdu.

After the signing of the contract, the relevant leaders of the group went to the project construction site for an inspection. (China Overseas Holdings Group)